Modern consumers require wireless and mobile telecommunication device to be small, portable, high performance and have multitasking capabilities. Miniaturization of the widely popular surface acoustic wave (SAW) resonator on a silicon chip would be highly beneficial for integrated communication circuits. Conventionally, SAW device is implemented on the piezoelectric material which makes it incompatible with CMOS technology process. The latest advancement of micro electromechanical systems (MEMS) fabrication method allows miniaturization and integration of the SAW device with integrated circuits. This work presents the design and simulation of MEMS SAW resonator. There are two structures that have been developed; the first structure is a typical MEMS SAW resonator of 218MHz on LiNbO3 where the IDT and reflectors are deposited on top of the substrate. This structure was designed in order to study design parameters that affect the behaviour and performance of SAW resonator. The latter is a CMOS SAW resonator which comprises of four stacked layers: ZnO/Al/SiO2. Four resonators were modeled based on operating frequencies of 850MHz, 900MHz, 1.8GHz and 1.9GHz. The optimum thickness of ZnO is studied to improve the resonator performance. FEM simulation analysis using COMSOL MultiphysicsTM was conducted to obtain the resonance frequency that provides maximum displacement while Matlab was used to calculate the insertion loss. The finding shows that the resonator at 850MHz with 3.08?m thickness of ZnO is the most optimal design since it produces the lowest insertion loss 4.9dB and the highest Q factor 1411.

The rapid growth of the wireless communication industry has increased the need for more efficient and stable RF components. Surface Acoustic Wave (SAW) devices have been a key player in existing RF transceiver systems, functioning as a frequency synthesizer or as an RF filter. Surface Acoustic Wave (SAW) devices have emerged as the most unique of RF passive components, having advantages of being small, rugged, lightweight and easily reproducible. A typical SAW device is composed of a piezoelectric substrate with thin-film metallic structures such as IDTs and reflectors deposited on top of the substrate's surface. This work presents development of integrated SAW resonator on CMOS which focused on the post-CMOS fabrication process, characterization and measurement. The post-CMOS fabrication process includes Reactive Ion Etching (RIE), deposition of piezoelectric layer and wet etching. For deposition of piezoelectric layer, Taguchi Optimization method was implemented to produce better result. After completion of the fabrication, characterization was done using XRD, FeSEM and SEM to evaluate the crystallinity quality. In the end, the result of the SAW resonator frequency response exhibits much better performance if the thickness of the piezoelectric layer is reduced with less loss.The end results improved the achievement of device in terms of Q-factor, insertion loss and coupling coefficient compared to previous work done. The Q-factor of 300 was achieved for this research and at the same time the loss was reduced to minimum of -6.13 dB and with the coupling coefficient of 5.4.

This research presents the design and simulation of surface acoustic wave (SAW) resonators for biosensing applications. This novel biosensor will integrate both mass and impedance sensing techniques. Acoustic wave biosensors utilize acoustic waves propagating on the surface of piezoelectric material as a detection mechanism. Any variations of the propagation path affect the velocity or amplitude of the wave. Changes in velocity can be monitored using frequency measurements which correspond to changes in mass of the propagating waves. There are many properties related to the biological cell that have to be taken into account such as its Young's modulus, Poisson's ratio and density. The device will be integrated with impedance sensing electrodes - one reference metal electrode and one working metal electrode. With the cells attached and spread on the electrodes, the impedance sensing will measure the change in impedance due to the cells placement. The novelty of the device is in the integration of mass and impedance sensing hence this is the aspect which would be the main focus. Biosensors which are currently available on-theshelves so far only provide either mass or impedance sensing - separately. Thus, the objective of this research is to simulate and find the best design that can incorporate both measurements at the same time. Study on the SAW resonators for biosensing applications will be conducted to provide concise information on this area of research. Simulations will be done using COMSOL MultiphysicsTM to find the optimum design. Several simulation models were design in simulating surface acoustic wave (SAW) and they vary with each other in terms of the delay line and interdigitated transducers' (IDTs) width. From the simulation results, it is observed that a biosensor with 6μm IDTs width has the highest eigenfrequency value which is 580MHz. Similar MEMS biosensor design was modelled to be simulated for its impedance sensing by varying the cell concentration and position of cell from the electrode plane. It could be seen that the increment in impedance value is directly proportional to the increase of cell concentration and when the cell is placed on the electrode.